CSP Process

CSP Process
(Chip scale Package)

The key value of QMC are “the people” and “the technology”.
Our employees, as the people, clearly understand the market and the clients and deliver the products and solutions in a timely fashion.

LDT-100

LED Die Transfer
  • High Throughput
  • High Position Accuracy

LPC-210

LED Phosphor Coater
  • Chip Tilting Free
  • Throughput Improvement

LBC-100

LED Blade Cutter
  • CSP Cutting width uniformity improvement

LCP-200/280

LED Chip Prober
  • Master PKG Correlation, Repeatable
  • Throughput Improvement
  • Wafer Level or single PKG Probing

LCS-400/420

LED Chip Sorter
  • PKG damage Free by Pick up
  • Anti Sticky function

LTM-200

LED Taping Machine
  • PKG Isolation solution by Pick up
  • Rework function