microLED Laser Lift-off System-DPSS
microLED Laser Lift-off System-Excimer
microLED Laser Bonding System
miniLED Transfer System
miniLED Laser Repair System
Wafer Back-side Laser marking system
Die Inspection & Sorting System
Wafer Spin Coater - CIS
Wafer Spin Remover - CIS
Laser Drilling System - MEMS Probe Card
Auto Pin Insert System - MEMS Probe Card
Die Transfer
microLED Laser Lift-off System-DPSS
microLED Laser Lift-off System-Excimer
microLED Laser Bonding System
miniLED Laser Repair System
Laser Drilling System - MEMS Probe Card
Wafer Laser Full cutting System - Sapphire
Laser Scribing System
Laser Marking System
VICSEL Tester
Tray Cover Attaching System
Laser Marking System - Shield Can
Wafer Laser Full cutting System - Sapphire
LED Test Handler
Taping Machine
Sorter
Prober
Dispenser
Phosphor Coater
CSP Blade Cutter
CSP Process
(Chip scale Package)
The key value of QMC are “the people” and “the technology”.
Our employees, as the people, clearly understand the market and the clients and deliver the products and solutions in a timely fashion.
LDT-100
LED Die Transfer
High Throughput
High Position Accuracy
LPC-210
LED Phosphor Coater
Chip Tilting Free
Throughput Improvement
LBC-100
LED Blade Cutter
CSP Cutting width uniformity improvement
LCP-200/280
LED Chip Prober
Master PKG Correlation, Repeatable
Throughput Improvement
Wafer Level or single PKG Probing
LCS-400/420
LED Chip Sorter
PKG damage Free by Pick up
Anti Sticky function
LTM-200
LED Taping Machine
PKG Isolation solution by Pick up
Rework function