Conventional LED
Phosphor Coater
Phosphor Coater
LPC-210
QMC LPC Series is equipment that coats Phosphor on Flip Chip in a uniform thickness by applying Hybrid Coating head. By applying the vacuum chamber structure, the equipment prevents bubble formation inside the phosphor. Pre-Heating Zone allows high productivity by minimizing the deformation of the material when moving.
OUTPUT
FEATURES
- High throughput performance and stability for mass production
- Hybrid Coating Head for applying the phosphor as uniform thickness
- Vacuum Chamber Structure for preventing the bubble generation when applying the phosphor
- Pre-Curing function for preventing phosphor fluid flow and variation after applying the phosphor
SPECIFICATION
| Item | LPC-210 | 비고 |
|---|---|---|
| Coating Size | 100mm X 100mme | |
| Loading / Unloading | Steel Ring Frame | |
| Cassette Slot | 25 Slot | |
| Coating Uniformity | ±15㎛ @ chip thickness less than 350㎛ |
Typ. Chip thickness 150㎛ Depending on the Silicone + Phosphor mix ratio and the viscosity, uniformity results may vary |
| Coating Height Control | Auto | |
| Displacement Measurement | Laser Sensor | |
| Coating Speed | 0.7mm/sec | CPS 3600 (Silicone + Phosphor) |
| Pre-cure Zone | Plate Heater. max. 300°C | Pre-cure time;300sec |