Die Transfer

DT Series

LDT-100, CDT-300

QMC DT Series is a fully automated mass production equipment that sorts devices into designated good/defective standards. Also, the QMC DT Series can realize high precise array accuracy for post-processing. The equipment offers high productivity as by classifying devices according to the grades customers desire, minimizing chip damage with quick and stable Pick & Place, and realizing high precision array Accuracy.


  • High throughput performance and stability for mass production
  • Stable high speed and high accuracy through the joint-less integrated picker
  • Real-time Chip Alignment monitoring
  • Real-time force control to prevent chip damage during pickup
  • Automatic vision inspection for double chip and damaged chip
  • Automatic barcode reader for efficient operation
Item LDT-100 CDT-300
Wafer Status Expanded wafer
Up to 6inch
Expanded wafer 
Die Size 300㎛ X 300㎛ ~ 2,000㎛ X 2,000㎛ 0.5mm X 0.5mm ~ 17mm X 17mm
Input Cassette Slot 25 Slot Standard Cassette
Output Cassette Slot 25 Slot Standard Cassette
Placement Accuracy (x, y axis) ≤ ±15㎛ ≤ ±30㎛
Placement Accuracy (theta axis) ≤ ±3° ≤ ±1°
Tact time 150ms (Die Size : 1mm X 1 mm 기준) 300ms (Die Size : 6 X 6 mm 기준)