Conventional LED
Die Transfer
DT Series
LDT-100, CDT-300
QMC DT Series is a fully automated mass production equipment that sorts devices into designated good/defective standards. Also, the QMC DT Series can realize high precise array accuracy for post-processing. The equipment offers high productivity as by classifying devices according to the grades customers desire, minimizing chip damage with quick and stable Pick & Place, and realizing high precision array Accuracy.
OUTPUT
FEATURES
- High
throughput performance and stability for mass production
- Stable
high speed and high accuracy through the joint-less integrated picker
- Real-time
Chip Alignment monitoring
- Real-time
force control to prevent chip damage during pickup
- Automatic
vision inspection for double chip and damaged chip
- Automatic
barcode reader for efficient operation
SPECIFICATION
| Item | LDT-100 | CDT-300 |
|---|---|---|
| Wafer Status | Expanded wafer Up to 6inch |
Expanded wafer 8inch/12inch |
| Die Size | 300㎛ X 300㎛ ~ 2,000㎛ X 2,000㎛ | 0.5mm X 0.5mm ~ 17mm X 17mm |
| Input Cassette Slot | 25 Slot | Standard Cassette |
| Output Cassette Slot | 25 Slot | Standard Cassette |
| Placement Accuracy (x, y axis) | ≤ ±15㎛ | ≤ ±30㎛ |
| Placement Accuracy (theta axis) | ≤ ±3° | ≤ ±1° |
| Tact time | 150ms (Die Size : 1mm X 1 mm 기준) | 300ms (Die Size : 6 X 6 mm 기준) |