QMC LCP series is a fully automated mass production equipment that measures the electrical and optical properties of light emitting devices arranged in units on wafer or substrates. The equipment’s structure is optimized for each device. By implementing the measurement on die-level or wafer-level, QMC LCP series can offer stable measurement reliability and high productivity.
Item | LCP-200 | LCP-280 |
---|---|---|
Wafer Size | Up to 6inch | Up to 6inch |
Die Size | 100㎛ X 100㎛ ~ 2,000 ㎛ X 2,000㎛ | 300㎛ X 300㎛ ~ 2,000㎛ X 2,000㎛ |
Probing type | Wafer-level | Die-level |
Wafer Cassette Slot | 25 Slot | 25 Slot |
Tact time | 200ms @ 100ms test time | 280ms @ 100ms test time |
System dimension | 1050 X 1150 X 1710 (mm) (W X D X H) | 1460 X 1300 X 1700 (mm) (W X D X H) |