Camera Module
Laser Lift-Off System
Laser Lift-Off System
SLO-100
QMC Laser Lift Off System, SLO Series is equipment utilizing excimer laser to remove GaN or AIN thin film from sapphire. The system can remove the thin films in sizes from wafer level to various chip levels. The films can be used in high brightness LED chip process or laminated semiconductor devices that require microfabrication process.
OUTPUT
FEATURES
- High
Grade Optics for Longer life and Optimal beam transmission
- Granite
base integrated to eliminate Vibration
- Beam
density control for optimum process condition
- Automatic
wafer alignment & Beam focusing
- Automatic
mask switching/changing function
- Real-time
Laser beam intensity monitoring
- Proprietary
Vacuum head for debris/particle to protect optics
SPECIFICATION
| Item | SLO-100 | 비고 |
|---|---|---|
| Wafer Size | Up to 6inch | |
| Wafer cassette slot | 25ea | |
| Maximum beam size | 4mm X 4mm | |
| System dimension | 2700 X 1000 X 2300 (mm) (W X D X H) |