QMC Laser Lift Off System, SLO Series is equipment utilizing excimer laser to remove GaN or AIN thin film from sapphire. The system can remove the thin films in sizes from wafer level to various chip levels. The films can be used in high brightness LED chip process or laminated semiconductor devices that require microfabrication process.
|Wafer Size||Up to 6inch|
|Wafer cassette slot||25ea|
|Maximum beam size||4mm X 4mm|
|System dimension||2700 X 1000 X 2300 (mm) (W X D X H)|