Camera Module
Laser Cutting System
SLS Series
SLS-100, SLS-300
QMC SLS Series series is a fully automatic mass production equipment that cuts or draws cutting line on wafers or substrates. Further, the equipment can irradiate laser beam inside the medium for the process. To serve the needs of clients, the system can cut metal substrates other than silicon and silicon. It offers various convenience features that enhance user's convenience for additional productivity and yield.
OUTPUT
FEATURES
- Able to process single wafer / partial wafer
- Compact Design for small foot print
- Automatic compensation for dicing street and wafer thickness
- High throughput and efficiency
SPECIFICATION
| Item | SLS-100 | SLS-300 |
|---|---|---|
| Wafer Size |
Up to 6inch | Up to 6inch |
| Scribing Side |
Top side/Black side | - |
| Wafer Cassette Slot | 25 Slot | 25 Slot |
| Scribing Speed | Max. 300mm/sec | Max. 1000mm/sec |
| System dimension | 1500 X 1845 X 1850 (mm) (W X D X H) | 1300 X 1360 X 1480 (mm) (W X D X H) |