QMC SLS Series series is a fully automatic mass production equipment that cuts or draws cutting line on wafers or substrates. Further, the equipment can irradiate laser beam inside the medium for the process. To serve the needs of clients, the system can cut metal substrates other than silicon and silicon. It offers various convenience features that enhance user's convenience for additional productivity and yield.
||Up to 6inch||Up to 6inch|
||Top side/Black side||-|
|Wafer Cassette Slot||25 Slot||25 Slot|
|Scribing Speed||Max. 300mm/sec||Max. 1000mm/sec|
|System dimension||1500 X 1845 X 1850 (mm) (W X D X H)||1300 X 1360 X 1480 (mm) (W X D X H)|