· 제품정보

microLED(miniLED) Display: - microLED Laser Lift-off System-DPSS; - microLED Laser Lift-off System-Excimer; - microLED Laser Bonding System; - miniLED Transfer System; - miniLED Laser Repair System

Semiconductor: - Wafer Back-side Laser marking system; - Die Inspection & Sorting System; - Wafer Spin Coater - CIS; - Wafer Spin Remover - CIS; - Laser Drilling System - MEMS Probe Card; - Auto Pin Insert System - MEMS Probe Card; - Die Transfer

Laser: - microLED Laser Lift-off System-DPSS; - microLED Laser Lift-off System-Excimer; - microLED Laser Bonding System; - miniLED Laser Repair System; - Laser Drilling System - MEMS Probe Card; - Wafer Laser Full cutting System - Sapphire; - Laser Scribing System; - Laser Marking System

Camera Module: - VICSEL Tester; - Tray Cover Attaching System; - Laser Marking System - Shield Can

Conventional LED: - Wafer Laser Full cutting System - Sapphire; - LED Test Handler; - Taping Machine; - Sorter; - Prober; - Dispenser; - Phosphor Coater; - CSP Blade Cutter

· 회사소개

· 고객지원

Conventional LED
Prober

LCP Series

LCP-200, LCP-280

QMC LCP Series는 Wafer 또는 기판 단위에 배열되어 있는 발광 소자의 전기적, 광학적 특성을 측정하는 전자동 양산설비 입니다. 각 소자가 가진 특성에 맞는 최적화된 측정 구조로 구성되며, Die-level 또는 Wafer-level 상의 측정을 구현하여, 안정된 측정 신뢰성과 높은 생산성 제공이 가능합니다.

OUTPUT

FEATURES

High throughput performance and stability for mass production
Automatic vision inspection for double chip and damaged chip
Custom designed integrating sphere and probe card available
High Measurement accuracy

SPECIFICATION

Item	LCP-200	LCP-280
Wafer Size	Up to 6inch	Up to 6inch
Die Size	100㎛ X 100㎛ ~ 2,000 ㎛ X 2,000㎛	300㎛ X 300㎛ ~ 2,000㎛ X 2,000㎛
Probing type	Wafer-level	Die-level
Wafer Cassette Slot	25 Slot	25 Slot
Tact time	200ms @ 100ms test time	280ms @ 100ms test time
System dimension	1050 X 1150 X 1710 (mm) (W X D X H)	1460 X 1300 X 1700 (mm) (W X D X H)