· 제품정보

microLED(miniLED) Display: - microLED Laser Lift-off System-DPSS; - microLED Laser Lift-off System-Excimer; - microLED Laser Bonding System; - miniLED Transfer System; - miniLED Laser Repair System

Semiconductor: - Wafer Back-side Laser marking system; - Die Inspection & Sorting System; - Wafer Spin Coater - CIS; - Wafer Spin Remover - CIS; - Laser Drilling System - MEMS Probe Card; - Auto Pin Insert System - MEMS Probe Card; - Die Transfer

Laser: - microLED Laser Lift-off System-DPSS; - microLED Laser Lift-off System-Excimer; - microLED Laser Bonding System; - miniLED Laser Repair System; - Laser Drilling System - MEMS Probe Card; - Wafer Laser Full cutting System - Sapphire; - Laser Scribing System; - Laser Marking System

Camera Module: - VICSEL Tester; - Tray Cover Attaching System; - Laser Marking System - Shield Can

Conventional LED: - Wafer Laser Full cutting System - Sapphire; - LED Test Handler; - Taping Machine; - Sorter; - Prober; - Dispenser; - Phosphor Coater; - CSP Blade Cutter

· 회사소개

· 고객지원

Conventional LED
Taping Machine

LTM Series

LTM-100, LTM-200

QMC LTM Series는 지정된 등급으로 분류된 소자를 양품/불량품 판정 후 Carrier Tape 에 옮기는 전자동 양산설비 입니다. 소자의 특성에 따라 전기적 특성검사/비젼검사 기능을 통하여 보다 안정적이고 신뢰성 높은 제품출하가 가능합니다.

OUTPUT

FEATURES

High throughput performance and stability for mass production
Automatic barcode reader for efficient operation
Easy to check and replace collet and eject pin with vision system
[Option] ‘Auto repair’ function to examine and remove the PKG non-inserted and mis-inserted to carrier Tape
[Option] Rework(Re-taping) function implementation by Taping Remover

SPECIFICATION

Item	LTM-100	LTM-200
Wafer Status	Expanded wafer	Expanded wafer
Die Size	300㎛ X 300㎛ ~ 2,000㎛ X 2,000㎛	300㎛ X 300㎛ ~ 2,000㎛ X 2,000㎛
Input Cassette Slot	25 Slot	25 Slot
Reel Size	Max. 23 inch	Max. 23 inch
Test Type	Vision Inspection	Electric Measurement
Tact time	250ms	300ms