제품정보
회사소개
인재채용
고객지원
· 제품정보
microLED(miniLED) Display
- microLED Laser Lift-off System-DPSS
- microLED Laser Lift-off System-Excimer
- microLED Laser Bonding System
- miniLED Transfer System
- miniLED Laser Repair System
Semiconductor
- Wafer Back-side Laser marking system
- Die Inspection & Sorting System
- Wafer Spin Coater - CIS
- Wafer Spin Remover - CIS
- Die Transfer
Probe Card
- Laser Drilling System - MEMS Probe Card
- Auto Pin Insert System - MEMS Probe Card
Laser
- microLED Laser Lift-off System-DPSS
- microLED Laser Lift-off System-Excimer
- microLED Laser Bonding System
- miniLED Laser Repair System
- Laser Drilling System - MEMS Probe Card
- Wafer Laser Full cutting System - Sapphire
- Laser Scribing System
- Laser Marking System
Camera Module
- VICSEL Tester
- Tray Cover Attaching System
- Laser Marking System - Shield Can
Conventional LED
- Wafer Laser Full cutting System - Sapphire
- LED Test Handler
- Taping Machine
- Sorter
- Prober
- Dispenser
- Phosphor Coater
- CSP Blade Cutter
· 회사소개
- About
- 회사연혁
- 회사소식
- 보도자료
- 위치정보
· 고객지원
- 기술/구매 문의
- 글로벌 서포트
제품정보
microLED(miniLED) Display
· microLED Laser Lift-off System-DPSS
· microLED Laser Lift-off System-Excimer
· microLED Laser Bonding System
· miniLED Transfer System
· miniLED Laser Repair System
Semiconductor
· Wafer Back-side Laser marking system
· Die Inspection & Sorting System
· Wafer Spin Coater - CIS
· Wafer Spin Remover - CIS
· Die Transfer
Probe Card
· Laser Drilling System - MEMS Probe Card
· Auto Pin Insert System - MEMS Probe Card
Laser
· microLED Laser Lift-off System-DPSS
· microLED Laser Lift-off System-Excimer
· microLED Laser Bonding System
· miniLED Laser Repair System
· Laser Drilling System - MEMS Probe Card
· Wafer Laser Full cutting System - Sapphire
· Laser Scribing System
· Laser Marking System
Camera Module
· VICSEL Tester
· Tray Cover Attaching System
· Laser Marking System - Shield Can
Conventional LED
· Wafer Laser Full cutting System - Sapphire
· LED Test Handler
· Taping Machine
· Sorter
· Prober
· Dispenser
· Phosphor Coater
· CSP Blade Cutter
회사소개
About
회사연혁
회사소식
보도자료
위치정보
인재채용
고객지원
- 기술/구매 문의
- 글로벌 서포트
언어
- 영어
회사소개
회사소식
회사소식
제목
제10기 결산공고(재무상태표)
작성자
QMC
작성일
2014-03-28 17:02
SEMICON CHINA 2014
제11기 결산공고(재무상태표)
목록