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microLED(miniLED) Display: - microLED Laser Lift-off System-DPSS; - microLED Laser Lift-off System-Excimer; - microLED Laser Bonding System; - miniLED Transfer System; - miniLED Laser Repair System

Semiconductor: - Wafer Back-side Laser marking system; - Die Inspection & Sorting System; - Wafer Spin Coater - CIS; - Wafer Spin Remover - CIS; - Die Transfer

Probe Card: - Laser Drilling System - MEMS Probe Card; - Auto Pin Insert System - MEMS Probe Card

Laser: - microLED Laser Lift-off System-DPSS; - microLED Laser Lift-off System-Excimer; - microLED Laser Bonding System; - miniLED Laser Repair System; - Laser Drilling System - MEMS Probe Card; - Wafer Laser Full cutting System - Sapphire; - Laser Scribing System; - Laser Marking System

Camera Module: - VICSEL Tester; - Tray Cover Attaching System; - Laser Marking System - Shield Can

Conventional LED: - Wafer Laser Full cutting System - Sapphire; - LED Test Handler; - Taping Machine; - Sorter; - Prober; - Dispenser; - Phosphor Coater; - CSP Blade Cutter

· 회사소개

· 고객지원

Semiconductor
Wafer Spin Remover - CIS

CSR Series

CSR-300

QMC CSR Series설비는 CIS wafer를 Die 단위로 Sawing 후 발생하는 파티클과 진행중 발행하는 Damage로부터 보호하기 위해 도포된 Coating 용액을 전용 용해제와 DI Water를 사용하여 제거(세정)해주는 전 자동 설비입니다.

OUTPUT

FEATURES

Particle Free(10ea); 2류체 Nozzle
8inch, 12inch Wafer Conversion Free

SPECIFICATION

Item	CSR-300
Wafer Size	8 ~ 12”
Wafer Supply	Load Port (Cassette)
Transfer	Travel type Robot (Dual Arm)
Wafer Align Accuracy	X, Y ≤ ±0.5mm
Configuration	Load Port, ATM Robot, Remover
System Dimension(W x D x H)	2,050 mm x 2,830 mm x 2,010 mm
Spindle Unit	Chuck Rotate Speed: MAX. 3000 RPM
Clean Room Class	10 Class