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microLED(miniLED) Display: - microLED Laser Lift-off System-DPSS; - microLED Laser Lift-off System-Excimer; - microLED Laser Bonding System; - miniLED Transfer System; - miniLED Laser Repair System

Semiconductor: - Wafer Back-side Laser marking system; - Die Inspection & Sorting System; - Wafer Spin Coater - CIS; - Wafer Spin Remover - CIS; - Die Transfer

Probe Card: - Laser Drilling System - MEMS Probe Card; - Auto Pin Insert System - MEMS Probe Card

Laser: - microLED Laser Lift-off System-DPSS; - microLED Laser Lift-off System-Excimer; - microLED Laser Bonding System; - miniLED Laser Repair System; - Laser Drilling System - MEMS Probe Card; - Wafer Laser Full cutting System - Sapphire; - Laser Scribing System; - Laser Marking System

Camera Module: - VICSEL Tester; - Tray Cover Attaching System; - Laser Marking System - Shield Can

Conventional LED: - Wafer Laser Full cutting System - Sapphire; - LED Test Handler; - Taping Machine; - Sorter; - Prober; - Dispenser; - Phosphor Coater; - CSP Blade Cutter

· 회사소개

· 고객지원

Semiconductor
Wafer Spin Coater - CIS

CSC Series

CSC-300

QMC CSC-300설비는 Back-end 공정 완료 전까지 진행 중 발생되는 파티클과 진행중 발생하는 Damage로부터 CIS Die표면을 보호하기 위하여 공정 Wafer 표면에 보호 용액을 도포(Coating)하는 장비입니다.

OUTPUT

FEATURES

Coating Uniformity; ±15% @ Thk. 1.1 μm
Temperature Uniformity; ± 3 ℃ @ ≤ 200

SPECIFICATION

Item	CSC-300
Wafer Size	8 ~ 12”
Wafer Supply	Load Port (FOUP)
Transfer	Travel type Robot (Dual Arm)
Wafer Align Accuracy	X, Y ≤ ±0.5mm
Configuration	Load Port, ATM Robot, Pre-Cleaning, Coating, Baking, Cooling, Nozzle
System Dimension(W x D x H)	2,220 mm x 3,060 mm x 2,020 mm
Coating Unit	A/C Servo Motor Drive Chuck Rotate Speed: MAX. 3000 RPM
Uniformity	Coating Thickness ≤ ±15% @ 1~3um
Bake Zone	Max Temp. 200 °C Temp. Uniformity ≤ ± 3℃
Cooling Zone	23℃ ± 3℃
Clean Room Class	10 Class