· 제품정보
- microLED(miniLED) Display
- - microLED Laser Lift-off System-DPSS
- - microLED Laser Lift-off System-Excimer
- - microLED Laser Bonding System
- - miniLED Transfer System
- - miniLED Laser Repair System
- Semiconductor
- - Wafer Back-side Laser marking system
- - Die Inspection & Sorting System
- - Wafer Spin Coater - CIS
- - Wafer Spin Remover - CIS
- - Die Transfer
Laser
miniLED Laser Repair System
SLR Series
SLR-200
QMC SLR Series는 mini LED Module의 점등검사 후 점등 불량 LED chip을 제거 및 실장하고 Laser로 Soldering하여 PCB 기판을 수리하는 전자동 장비입니다.
OUTPUT
FEATURES
- Damage Free Process
- Stable Top Hat Beam Implementation
- Dual Power Density Control at Single Laser Head
- Stable Detachment and Attachment of Chips - Fast and Accurate Vision Alignment Module with Specially Designed S/W Algorithm
- Compact Design for Small Foot Printing Friendly User Interface
- Easy Maintenance
- Auto Tool Cleaner
- Auto Calibration; Collet, Eject Pin
- Easy Conversion for Model Change; Automatic Variation in Spot Size, etc
SPECIFICATION
| Item | Spec |
|---|---|
| Load & Unload Type | Load (Wafer Cassette), Unload (Conveyor & transfer) |
| Source Type | 6 inch hoop ring (Blue tape) |
| Source Chip Size | 60 x 100um ~ 590 x 730um |
| Target Type | PCB Substrate (Rigid, FPCB) |
| Target Substrate Size | 120 x 80mm ~ 230 x 200mm, 0.8~1.3T |
| Laser | IR Laser |
| Dispense Type | Stamp (Dotting) |
| Dispense Dotting Spec | Size(80um, ±10um), Height : 30um 이하 |
| Attach Type | Picker(Tension collet) |
| Attach Place Accuracy | X, Y ≤ ±10um, Ө ≤ ±3° |
| Vision Alignment | Source Alignment, Chip Alignment, Target Alignment |
| Vision Inspection | Laser Remove, Dotting, Place Accuracy |
| Tact Time | ≤ 30sec/chip |
| System Dimension(W x D x H) | 2,100mm x 1,400mm x 1,870mm |