· 제품정보

microLED(miniLED) Display: - microLED Laser Lift-off System-DPSS; - microLED Laser Lift-off System-Excimer; - microLED Laser Bonding System; - miniLED Transfer System; - miniLED Laser Repair System

Semiconductor: - Wafer Back-side Laser marking system; - Die Inspection & Sorting System; - Wafer Spin Coater - CIS; - Wafer Spin Remover - CIS; - Die Transfer

Probe Card: - Laser Drilling System - MEMS Probe Card; - Auto Pin Insert System - MEMS Probe Card

Laser: - microLED Laser Lift-off System-DPSS; - microLED Laser Lift-off System-Excimer; - microLED Laser Bonding System; - miniLED Laser Repair System; - Laser Drilling System - MEMS Probe Card; - Wafer Laser Full cutting System - Sapphire; - Laser Scribing System; - Laser Marking System

Camera Module: - VICSEL Tester; - Tray Cover Attaching System; - Laser Marking System - Shield Can

Conventional LED: - Wafer Laser Full cutting System - Sapphire; - LED Test Handler; - Taping Machine; - Sorter; - Prober; - Dispenser; - Phosphor Coater; - CSP Blade Cutter

· 회사소개

· 고객지원

Camera Module
Tray Cover Attaching System

OIS Series

OIS-100

QMC OIS Series는 Camera Module 제조용 부품이 담긴 Tray(또는 Carrier)에 보호 Cover를 장착해 주는 전자동 In-line장비입니다.

SPECIFICATION

Item	OIS-100
Substrate	200mm x 110mm, 0.5T~2T
Configuration	Conveyor, Cover Supplier, Aligner, Transfer, Inspection, Flipper, Magazine
System Dimension(W x D x H)	2,390 mm x 1,270 mm x 1700 mm
Throughput Tact Time	13 sec/Carrier
Throughput UPH	5,800 unit/hour @ (21unit/Carrier)
Vision	1/1.8” Camera, Pixel Resolution 6.9 μm
Load/Un-Load	Conveyor / Magazine
Copntrol S/W	PC Control