· 제품정보

microLED(miniLED) Display: - microLED Laser Lift-off System-DPSS; - microLED Laser Lift-off System-Excimer; - microLED Laser Bonding System; - miniLED Transfer System; - miniLED Laser Repair System

Semiconductor: - Wafer Back-side Laser marking system; - Die Inspection & Sorting System; - Wafer Spin Coater - CIS; - Wafer Spin Remover - CIS; - Die Transfer

Probe Card: - Laser Drilling System - MEMS Probe Card; - Auto Pin Insert System - MEMS Probe Card

Laser: - microLED Laser Lift-off System-DPSS; - microLED Laser Lift-off System-Excimer; - microLED Laser Bonding System; - miniLED Laser Repair System; - Laser Drilling System - MEMS Probe Card; - Wafer Laser Full cutting System - Sapphire; - Laser Scribing System; - Laser Marking System

Camera Module: - VICSEL Tester; - Tray Cover Attaching System; - Laser Marking System - Shield Can

Conventional LED: - Wafer Laser Full cutting System - Sapphire; - LED Test Handler; - Taping Machine; - Sorter; - Prober; - Dispenser; - Phosphor Coater; - CSP Blade Cutter

· 회사소개

· 고객지원

microLED(miniLED) Display
microLED Laser Lift-off System-Excimer

ELO Series

ELO-100

QMC ELO Series는 Excimer Laser를 이용하여, Sapphire Wafer 또는 Substrate에서 micro LED Chip을Laser로 분리하는 장비입니다.

OUTPUT

ELO-100(output1).png

ELO-100(output3).png

FEATURES

High Yield & Productivity
Process Stability; High Quality Beam Uniformity
Micro Beam Stitching Function; Laser Spot & LED Chip의 고속, 정밀 위치 동기화
Friendly User Interface

SPECIFICATION

Item	Spec
Laser Source	Excimer Laser
Line Spot Size	Max. 25 mm x 1 mm
Source	upto 6inch Wafer
Target	≤ 370 mm x 470 mm Substate
Stage	X-Y-Z-T(Linear Motor Drive)
Chuck	380 mm x 480 mm(Porous Vacuum)
Vision	Inspection & Alignment(2/3 inch, Pixel Resolution 0.345 um)
Cycle Time	16.3 sec/Wafer @ 4" Wafer
System Dimension(W x D x H)	4,500 mm x 2,700 mm x 2,950 mm