· 제품정보
- microLED(miniLED) Display
- - microLED Laser Lift-off System-DPSS
- - microLED Laser Lift-off System-Excimer
- - microLED Laser Bonding System
- - miniLED Transfer System
- - miniLED Laser Repair System
- Semiconductor
- - Wafer Back-side Laser marking system
- - Die Inspection & Sorting System
- - Wafer Spin Coater - CIS
- - Wafer Spin Remover - CIS
- - Die Transfer
Semiconductor
Wafer Back-side Laser marking system
SLM Series
SLM-300
QMC SLM series는 UV 테이프에 마운트 된 반도체 웨이퍼에 UV Tape을 투과하여 Chip의 밑면(Back-side)에 일련번호를 Laser로 마킹하는 장비입니다.
OUTPUT
FEATURES
- High Accuracy: Marking ≤ ± 50 um
- High Performance
- Tact Time; 128 sec/wafer(@ 12”)
- UPH; 28 wafer/hour(@ 12”) - 공정방식
- 1Scan, 2Scan
- Scan Field; Max. 12”
SPECIFICATION
| Item | Spec |
|---|---|
| Wafer | 8~12”(Ring Frame) |
| Configuration | Laser, Optics, Stage, ATM Robot, Vision |
| System Dimension(W x D x H) |
2,554 mm x 1,654 mm x 2,053 mm |
| Throughput Tact Time | 128 sec/wafer(12”) , 88.58 sec/wafer(8”) |
| Throughput UPH | 28 wafer/hour(12”), 40 wafer/hour(8”) |
| Marking Process | White Marking, Black marking |
| Marking Accuracy | ≤ ± 50 um, Size: ≥ 0.3 mm |
| Source | Green Laser |
| Stage | X, Y, T Axis(Servo Motor Drive) |
| Vision | 2/3” Camera, Pixel Resolution: 3.45 μm |
| Load/Un-Load | Cassette(ATM Robot Handling) |
| Control S/W | PC control |
| Option | OCR reading |