· 제품정보

microLED(miniLED) Display: - microLED Laser Lift-off System-DPSS; - microLED Laser Lift-off System-Excimer; - microLED Laser Bonding System; - miniLED Transfer System; - miniLED Laser Repair System

Semiconductor: - Wafer Back-side Laser marking system; - Die Inspection & Sorting System; - Wafer Spin Coater - CIS; - Wafer Spin Remover - CIS; - Die Transfer

Probe Card: - Laser Drilling System - MEMS Probe Card; - Auto Pin Insert System - MEMS Probe Card

Laser: - microLED Laser Lift-off System-DPSS; - microLED Laser Lift-off System-Excimer; - microLED Laser Bonding System; - miniLED Laser Repair System; - Laser Drilling System - MEMS Probe Card; - Wafer Laser Full cutting System - Sapphire; - Laser Scribing System; - Laser Marking System

Camera Module: - VICSEL Tester; - Tray Cover Attaching System; - Laser Marking System - Shield Can

Conventional LED: - Wafer Laser Full cutting System - Sapphire; - LED Test Handler; - Taping Machine; - Sorter; - Prober; - Dispenser; - Phosphor Coater; - CSP Blade Cutter

· 회사소개

· 고객지원

Conventional LED
Wafer Laser Full cutting System - Sapphire

SLF Series

SLF Series

QMC SLF Series는 다양한 소재의 Wafer를 Laser를 이용하여 개별 Chip으로 Grooving 또는 Full Cutting 하는 장비입니다.

OUTPUT

FEATURES

Application for Variable Material; Sapphire, Metal, Silicon, Ceramic, etc.
QMC Designed BDS for High Quality Cutting Performance
Included Coating & Cleaning unit to protect process particle
Auto Compensation of Scribing Position for Sapphire Crystalized Direction

SPECIFICATION

Item	SLF Series
Wafer	4inch
Configuration	Load Port, Transfer, Stage, Vision, Laser, BDS
System Dimension(W x D x H)	2,200mm x 2,250mm x 1,950mm
Throughput	≤ 7.3 wafer/hour @ Chip Size: 400um x 400um, Depth: 32um
Source	DPSS Laser
Stage	X, Y, θ, Z-Axis (Linear Motor & Scale)
Accuracy	X, Y, Z ≤ ±2um, θ ≤ ±0.001°
Optic	Objective Lens Mount Assembly and Adapter
Vision	2/3“Camera, Pixel Resolution 0.345 μm
Load/Un-Load	Cassette
Copntrol S/W	PC Control