· 제품정보
- microLED(miniLED) Display
- - microLED Laser Lift-off System-DPSS
- - microLED Laser Lift-off System-Excimer
- - microLED Laser Bonding System
- - miniLED Transfer System
- - miniLED Laser Repair System
- Semiconductor
- - Wafer Back-side Laser marking system
- - Die Inspection & Sorting System
- - Wafer Spin Coater - CIS
- - Wafer Spin Remover - CIS
- - Die Transfer
microLED(miniLED) Display
microLED Laser Bonding System
SLB Series
SLB-100
Laser Bonder는 접합성 전도물질이 인쇄된 Backplane과 Micro LED 기판을 정렬하여 열(Heat)과 Laser로 Hybrid Bonding하는 자동화 장비입니다.
수 um 사이즈의 Backplane전극과 Micro LED 기판의 전극 Pad를 1대1로 정렬하는 고 정밀 위치 제어 기술을 제공합니다.
OUTPUT
FEATURES
- High Yield & Productivity
- Process Stability; High Quality Beam Uniformity
- Micro Beam Stitching Function; Laser Spot & LED Chip의 고속, 정밀 위치 동기화
- Friendly User Interface
SPECIFICATION
| Item | Spec |
|---|---|
| Material MicroLED Substrate | Max. 20,000μm x 20,000μm |
| Material CMOS Backplane | Max. 21,000μm x 21,000μm |
| Configuration | Tray, Picker, Stage, Vision, Laser, Heater |
| Tact Time | ≤ 8 min/PKG |
| Bonding Accuracy | X, Y ≤ ±2㎛ |
| Laser | IR Laser |
| Stage | X1, X2, Y1, Y2, T Axis (Linear Motor Drive) Z Axis (VCM Drive) |
| Heater | AIN Ceramic Heater - Ramping up Rate 200°C/sec / Cool Down Rate 18°C/sec |
| Vision | 2/3” Camera, Pixel Resolution 0.345 μm |
| Load/Un-Load | JEDEC Tray |
| Control S/W | PC control |
| Option | 점등검사 |
| System Dimension(W x D x H) | 1,800mm x 1,800mm x 1,940mm(Exclude Signal lamp) |
| Heater |
AIN Ceramic Heater - Ramping up Rate 200°C/sec / Cool Down Rate 18°C/sec |