· 제품정보

microLED(miniLED) Display: - microLED Laser Lift-off System-DPSS; - microLED Laser Lift-off System-Excimer; - microLED Laser Bonding System; - miniLED Transfer System; - miniLED Laser Repair System

Semiconductor: - Wafer Back-side Laser marking system; - Die Inspection & Sorting System; - Wafer Spin Coater - CIS; - Wafer Spin Remover - CIS; - Die Transfer

Probe Card: - Laser Drilling System - MEMS Probe Card; - Auto Pin Insert System - MEMS Probe Card

Laser: - microLED Laser Lift-off System-DPSS; - microLED Laser Lift-off System-Excimer; - microLED Laser Bonding System; - miniLED Laser Repair System; - Laser Drilling System - MEMS Probe Card; - Wafer Laser Full cutting System - Sapphire; - Laser Scribing System; - Laser Marking System

Camera Module: - VICSEL Tester; - Tray Cover Attaching System; - Laser Marking System - Shield Can

Conventional LED: - Wafer Laser Full cutting System - Sapphire; - LED Test Handler; - Taping Machine; - Sorter; - Prober; - Dispenser; - Phosphor Coater; - CSP Blade Cutter

· 회사소개

· 고객지원

Probe Card
Laser Drilling System - MEMS Probe Card

SLD Series

SLD-100

QMC SLD Series는 반도체 Wafer 검사 목적의 MEMS Probe Card 기판 제조용 Laser Micro Machining 장비입니다. Micro Hole Drilling, Cutting, Marking의 기능을 제공합니다.

OUTPUT

FEATURES

High Performance
Minimum Hole Size 30um
Tact time ≤ 1sec/hole
High Accuracy
Position ≤ ±2μm
Size ≤ ±2μm
Taper Angle ≤ 0.5°
Variable Process Shape
Rectangle, circle, Triangle, etc.
Micro Machining; Drilling, Cutting, Marking.

SPECIFICATION

Item	SLD-100
Substrate	Si3N4: Thk. ≤ 0.35mm PHOTOVEEL: Thk. ≤ 0.35mm8 ~ 12”
Configuration	Stage, Vision, Laser, BDS, Dust Collector
System Dimension(W x D x H)	1,750 mm x 1,900 mm x 1,750 mm
Throughput	Tact time ≤ 1 sec/hole
Accuracy	Position ≤ ±2μm Hole Size ≤ ±2μm Taper Angle ≤ 0.5°
Source	UV or IR Laser Depend on Material
Stage	X, Y, Z Axis(Linear Motor Drive)
Vision	2/3” Camera, Pixel Resolution 0.345 μm
Load/Un-Load	Manual
Control S/W	PC Control